Hikari Tsushin to issue 15 bn yen in unsecured corporate bonds

On October 30, 2025, Hikari Tsushin Inc. announced its decision to issue its 54th series of unsecured corporate bonds with inter-bond pari passu clauses. The total issue amount will be 15 billion yen, with each bond valued at 1 million yen. The bonds carry an annual interest rate of 2.656%, with interest payments scheduled semiannually on May 6 and November 6 each year.

The issue price and redemption amount for each bond will be 100 yen per 100 yen of face value. The subscription payment date is set for November 6, 2025, and the bonds will mature on November 6, 2031, representing a a six-year term. The proceeds from this issuance will be allocated towards the redemption of existing corporate bonds.

Daiwa Securities Co. Ltd. will act as the lead underwriter, while Mizuho Bank, Ltd. will serve as the bond manager. Japan Securities Depository Center, Inc. is designated as the transfer agent. The bonds have received a credit rating of A+ from Japan Rating and Investment Information, Inc. and A from Rating and Investment Information, Inc.