Hikari Tsushin to issue ¥15 bn in new corporate bonds

Hikari Tsushin, Inc. announced on October 30, 2025, the terms for its 54th unsecured straight corporate bonds, with an inter-bond pari passu clause. The total issuance amounts to 15 billion yen, with individual bond denominations of 1 million yen. These bonds carry an annual coupon rate of 2.656% and will be issued and redeemed at 100% of their principal amount.

The bonds are scheduled for issue on November 6, 2025, and will mature on November 6, 2031. Coupon payments will be made semi-annually on May 6 and November 6. The proceeds from this issuance are earmarked for bond redemption. Daiwa Securities Co. Ltd. will serve as the underwriter, with Mizuho Bank, Ltd. acting as the trustee.

The bonds have received credit ratings of A+ from Japan Credit Rating Agency, Ltd. and A from Rating & Investment Information, Inc. Japan Securities Depository Center, Incorporated is designated as the Book-Entry Transfer Institution.