Hikari Tsushin issues ¥20 bn in new unsecured bonds

Hikari Tsushin, Inc. will issue its 52nd and 53rd series of unsecured corporate bonds on October 23, 2025, each valued at ¥10 billion, for a total of ¥20 billion. These bonds, issued in denominations of ¥1 million per bond, are intended to fund existing bond redemptions. The 52nd series, a three-year bond maturing on October 23, 2028, carries an annual interest rate of 1.654%, while the 53rd series, a five-year bond maturing on October 23, 2030, offers an annual interest rate of 2.271%.

Both bond series will be issued and redeemed at 100% of their principal amount. Interest payments will be made semi-annually on April 23 and October 23. The underwriting syndicate includes Nomura Securities, Daiwa Securities, Mizuho Securities, and SMBC Nikko Securities. Mizuho Bank will serve as the bond trustee, and the Japan Securities Depository Center will handle book-entry transfers.

The bonds have received credit ratings of A+ from Japan Credit Rating Agency, Ltd. and A from Rating & Investment Information, Inc. This issuance, formalized on October 17, 2025, aligns with the company's strategy to manage its outstanding debt obligations.