Rohm reorganizes domestic manufacturing into two specialized companies

Rohm Co., Ltd. will reorganize its domestic manufacturing operations, including its Shiga Plant and four manufacturing-related subsidiaries, into two new entities: a wafer process manufacturing company (WP Company) and an assembly process manufacturing company (AP Company). This aims to enhance manufacturing capabilities, productivity, and global competitiveness through optimized decision-making and resource allocation.

The reorganization will occur in two phases. On April 1, 2026, Rohm Apollo Co., Ltd., Rohm Wako Co., Ltd., and Rohm Hamamatsu Co., Ltd. will be integrated into the WP and AP Companies. Subsequently, on April 1, 2027, LAPIS Semiconductor Co., Ltd. will join these new structures, and Rohm's Shiga Plant will be transferred to the WP Company via an absorption-type split.

As of March 31, 2025, Rohm reported total net assets of JPY 889,655 million and total assets of JPY 1,440,765 million. The successor WP Company (Rohm Apollo Co., Ltd. before name change) had total net assets of JPY 58,710 million and total assets of JPY 95,063 million. This absorption-type company split, involving a wholly-owned subsidiary, is expected to have an immaterial impact on Rohm’s consolidated financial results forecast.