Rohm reorganizes domestic manufacturing for efficiency with new wafer, assembly units

Rohm Co. resolved on October 10, 2025, to reorganize its domestic manufacturing entities, including its Shiga Plant and four related companies, into two new manufacturing companies: a wafer process manufacturing company (WP Company) and an assembly process manufacturing company (AP Company). This aims to boost manufacturing capabilities and productivity through improved decision-making, quality enhancement, and resource optimization. The effective date for this absorption-type company split is projected for April 1, 2027.

The reorganization unfolds in two phases. On April 1, 2026, Rohm Apollo Co., Rohm Wako Co., and Rohm Hamamatsu Co. will be restructured into the WP and AP Companies. Subsequently, on April 1, 2027, LAPIS Semiconductor Co. will join these manufacturing entities, and the company’s Shiga Plant will be succeeded by the WP Company. This strategic move is classified as a simplified company split for Rohm and a short-form split for the WP Company, bypassing the need for shareholder approval.

The WP Company, currently Rohm Apollo Co., will have a projected capital of JPY450m. As of March 31, 2025, the division to be split, focused on wafer process manufacturing of electronic components, reported total assets of JPY35,806m. Rohm states that the impact on its consolidated financial results will be immaterial, as this split involves the company and its wholly-owned subsidiary.