Dydo Group Holdings issues JPY 5bn unsecured bonds

Dydo Group Holdings (TSE:2590) announced the issuance of JPY 5 billion in unsecured bonds, designated as the 4th Series of unsecured bonds with an inter-bond pari passu clause. The bonds will be issued at JPY 100 per JPY 100 of face value and will also be redeemed at JPY 100 per JPY 100 of face value. The interest rate is set at 1.614% per annum. The bonds have a 5-year maturity, with a final redemption date of July 12, 2030, payable in full at maturity. Interest will be paid semi-annually on January 15 and July 15. The application period is July 9, 2025, and the payment date is July 15, 2025. The offering is a general public offering. Nomura Securities, Mizuho Securities, and Mitsubishi UFJ Morgan Stanley Securities are the lead underwriters. Proceeds from the issuance will be allocated to the redemption of bonds. The bonds are rated A- by Japan Credit Rating Agency, Ltd. Resona Bank serves as the fiscal agent and payment agent.