Inspec secures large semiconductor package substrate inspection system order

Inspec Co., Ltd. announced today that it has won a significant order for multiple units of its semiconductor package substrate inspection systems and related equipment from an overseas client. The total value of the order exceeds JPY 780 million, which includes approximately JPY 230 million already received in February 2025. This order is driven by the increasing demand for AI technology and data centers, requiring advanced AI semiconductors, and the inspection systems will be used for ultra-high-end substrates. The company expects the demand for its semiconductor package substrate inspection systems to continue due to ongoing investment in semiconductor miniaturization and chiplet technology. Delivery is scheduled for the fiscal year ending April 2026, therefore no impact is expected on the current fiscal year ending April 2025. Inspec discloses large order exceeding 10% of yearly revenue.