Lomon Billions Group issues first tranche of 2025 innovation bonds

Lomon Billions Group announced the successful issuance of its 2025 first tranche science and technology innovation bonds, with funds totaling 50,000,000 yuan received by December 25, 2025. This issuance falls under the company's previously approved general authorization for bond financing tools, which allows for a total outstanding balance not exceeding 60 bn yuan. The bonds, designated as "25 Lomon Billions Group MTN001 (Tech Innovation Bond)," have a term of three years with an annual coupon rate of 2.14%. The bonds were issued at a price of 100.00 per hundred yuan face value, with interest accrual starting December 25, 2025, and redemption set for December 25, 2028.

The issuance follows the company's receipt of a registration notice from the China Interbank Market Traders Association (NAFMII) in December 2025, which accepted the registration of the company's science and technology innovation bonds. The registration allows for the issuance of medium-term notes with a total registered amount of 4 bn yuan, valid for two years from the registration notice date, enabling the company to issue the innovation bonds in tranches.

China CITIC Bank Corporation Limited served as both the bookrunner and lead underwriter for this issuance. Co-lead underwriters included Shanghai Pudong Development Bank Co., Ltd., Zhongyuan Bank Co., Ltd., Huaxia Bank Co., Ltd., China Merchants Bank Co., Ltd., and Industrial Bank Co., Ltd. Lomon Billions Group confirmed that it is not listed as a dishonest entity.