TCL technology's digital economy bonds oversubscribed by investors
TCL Technology Group Corp announced the successful issuance of its 2025 public offering of technology innovation corporate bonds (digital economy) (first tranche) to professional investors. The total issuance volume for this tranche was RMB 20 bn, divided into two varieties.
The first variety, with a maturity of 170 days, had an actual issuance size of RMB 5.00 bn and a coupon rate of 1.74%, with a subscription multiple of 3.6 times. The second variety, with a 3-year maturity, achieved an actual issuance size of RMB 15.00 bn and a coupon rate of 2.24%, attracting a subscription multiple of 3.8 times. The bonds were priced at RMB 100 per unit, utilizing an inquiry and placement method for professional institutional investors.
The company affirmed that the issuance process was fair and compliant, with no direct or indirect participation by the issuer in the subscription. The lead underwriters and their affiliates subscribed for RMB 4.30 bn, which was deemed fair and compliant.
This report was generated by FilingReader's AI system from regulatory filings and company disclosures. To request a correction, contact editorial@filingreader.com
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