Ping An Bank completes RMB6.5bn technology innovation bond issuance

Ping An Bank announced the successful completion of its 2025 Technology Innovation Bonds (Bond Connect) issuance. The bonds were priced on December 17, 2025, and issued on December 19, 2025, in the national interbank bond market. The total issuance size reached RMB6.5 billion, with a maturity period of three years.

The bonds carry a floating interest rate pegged to the one-year LPR, with a downward adjustment of 115 basis points, resulting in an initial coupon rate of 1.85%. This issuance aligns with regulatory approvals obtained by Ping An Bank.

The proceeds from these bonds are specifically earmarked for investment in the scientific and technological innovation sectors as defined by the "Financial 'Five Major Articles' Overall Statistical System (Trial)." This includes funding for technology loans and investments in bonds issued by technology innovation enterprises, thereby providing dedicated support for technology innovation-related businesses.