TCL Technology extends digital economy bond book-building, sets coupon rates

TCL Technology Group Corp has extended the book-building period for its 2025 publicly issued technology innovation corporate bonds (digital economy) (tranche 1) for professional investors. The original book-building period, scheduled for December 17, 2025, from 15:00 to 18:00, has been extended by one hour to conclude at 19:00 on the same day, due to procedural requirements for some investors.

Concurrently, TCL Technology announced the final coupon rates for the bonds, which are part of a larger offering of up to RMB 100 billion, with the current tranche not exceeding RMB 2 billion. Tranche one, with a term of 170 days, was priced at 1.74%, while tranche two, with a 3-year term, was priced at 2.24%. These rates were determined after a book-building process among professional institutional investors on December 17, 2025.

The offering will now proceed with offline issuance to professional investors from December 18 to December 19, 2025. Further details regarding subscription methods are available on the Shenzhen Stock Exchange and Cninfo websites.