Weifu High-Technology bonds to list on Shenzhen Stock Exchange

Wuxi Weifu High-Technology Group Co., Ltd. has announced the listing of its 2025 public issuance of technology innovation corporate bonds on the Shenzhen Stock Exchange. The bonds, specifically earmarked for the 465 modern industrial cluster, have a total issuance amount of 5 bn yuan and a 3-year term. They will begin trading on December 12, 2025, for professional institutional investors.

The bonds carry a fixed annual interest rate of 1.90% and will pay interest annually. The issuance date was from December 5 to December 8, 2025, with the interest accrual date set for December 8, 2025. The maturity date is December 8, 2028. Shanghai Brilliance Credit Rating & Investors Service Co., Ltd. has assigned an AAA rating to the issuer, though the specific bond issue itself is unrated.

With a par value of 100 yuan per bond and an opening reference price of 100 yuan, the bonds will trade through matched transactions, click-and-trade, inquiry-based transactions, competitive bidding, and negotiated transactions. This listing aligns with the Shenzhen Stock Exchange's regulations for bond market access.