Tianma Microelectronics to pay interest on 2021 corporate bonds

Tianma Microelectronics Co. will pay interest on its "21 Tianma 02" corporate bonds on December 9, 2025. The interest payment covers the period from December 9, 2024, to December 8, 2025. The current coupon rate for these bonds is 3.70%.

For every 10 bonds with a face value of CNY 1,000, an interest of CNY 37.00 (before tax) will be distributed. After tax, individual and securities investment fund bondholders will receive CNY 29.60 per 10 bonds, while non-resident enterprise bondholders (including QFII and RQFII) will receive CNY 37.00 per 10 bonds. The bond's outstanding balance is CNY 1 bn, with a term of 5 years.

The bond interest payment will be managed by China Securities Depository and Clearing Corporation Limited, Shenzhen Branch. The company emphasizes that tax obligations related to interest income fall on investors, with personal income tax on corporate bond interest being withheld at source by payment agencies. Non-resident enterprises are temporarily exempt from corporate income tax and value-added tax on interest income from investments in the domestic bond market from November 6, 2021, to December 31, 2025.