Weifu High-Tech extends bond book-building due to market volatility

Wuxi Weifu High-Technology Group Co., Ltd. (the "issuer") has extended the book-building period for its 2025 public issuance of science and technology innovation corporate bonds to professional investors. The issuance, designated for the "465 modern industrial cluster," has been approved by the China Securities Regulatory Commission (CSRC) for bonds not exceeding RMB 3 bn.

Initially, the book-building process for offline investors to inquire about interest rates was scheduled for December 4, 2025, from 15:00 to 18:00. However, due to significant market volatility on the day, the issuer, in agreement with the book-running managers and investors, decided to extend the closing time for the book-building period from 18:00 to 19:00.

This extension aims to ensure a fair and stable final determination of the bond's coupon rate amidst the market fluctuations. Further details will be announced following the conclusion of the extended book-building period.