TongFu Microelectronics seeks to raise up to 3 bn yuan in debt financing

TongFu Microelectronics' board of directors approved the proposed registration and issuance of debt financing instruments on November 28, 2025. The company plans to apply to the National Association of Financial Market Institutional Investors to issue non-financial enterprise debt financing instruments totaling up to 3 billion yuan.

This includes super short-term commercial paper of up to 1 billion yuan and medium-term notes of up to 2 billion yuan. The issuance aims to meet operational needs, optimize the debt structure, and broaden financing channels.

Concurrently, the board also approved revisions to the company’s articles of association, canceling the supervisory board and transferring its functions to the board’s audit committee, aligning with the amended company law. These changes, along with updates to various internal governance documents, require shareholder approval and regulatory filing. The supervisory board had reviewed and approved the proposed debt financing, confirming its compliance with regulations and alignment with the company's operational needs and shareholder interests. This proposal will be submitted for shareholder approval.