Inspur Electronic Information raises RMB 1 bn in innovation bonds

Inspur Electronic Information Industry Co., Ltd. announced the successful issuance of its 2025 Fifth Tranche of Science and Technology Innovation Bonds, raising RMB 1 bn. The proceeds from this bond issuance were fully received on November 14, 2025. The bonds, with a three-year term, carry an interest rate of 1.95% and will mature on November 14, 2028.

The issuance is part of a larger RMB 10 bn medium-term note registration, approved by the National Association of Financial Market Institutional Investors on October 21, 2025. This registration is valid for two years from the notification date.

China Everbright Bank Co., Ltd. served as the bookrunner and lead underwriter for this issuance, with China Everbright Bank Co., Ltd. as the co-lead underwriter. Further details are available on the China Money Network and Shanghai Clearing House websites.