BOE Technology to issue up to 1 bn yuan in innovation bonds

BOE Technology Group Co., Ltd. announced the public issuance of its 2025 Technology Innovation Corporate Bonds (Tranche 3) to professional investors. The total registered amount for this issuance is up to 10 bn yuan, with Tranche 3 not exceeding 1 bn yuan. The bonds have a five-year term and a fixed coupon rate between 1.5% and 2.5%, to be determined by book-building. United Credit Rating has assigned an AAA corporate credit rating with a stable outlook.

The proceeds from this tranche, after deducting issuance fees, will replace proprietary funds used for equity investments in the technology innovation sector within the previous 12 months. Specifically, 1 bn yuan will replace funds invested in Beijing BOE Chuangyuan Technology Co., Ltd. for its sixth-generation new semiconductor display device production line project, focusing on high-end display products.

The company will conduct an interest rate inquiry for professional institutional investors on November 12, 2025, with the final coupon rate announced on the same day. Subscription will take place on November 13 and 14, 2025. BOE Technology Group’s internal approvals for the bond issuance were completed with board approval on July 8, 2024, and shareholder approval on July 24, 2024.