BOE technology group closes second tranche of innovation bonds

BOE Technology Group Co. Ltd. announced the successful issuance of its 2025 technology innovation corporate bonds (second tranche) to professional investors. The issuance, with an approved size of up to 10 billion yuan, saw this tranche set at a maximum of 1 billion yuan. The actual issued amount was 1 billion yuan, with a fixed coupon rate of 1.95%.

The bonds, priced at 100 yuan per unit, were allocated through a book-building process for institutional investors. The issuance period spanned from November 5 to November 6, 2025.

Several underwriters participated in the subscription, including CITIC Securities Co. Ltd. (160 million yuan), Everbright Securities Co. Ltd. (120 million yuan), and a related party of First Capital Securities Co. Ltd. (150 million yuan). Additionally, a related party of Guolian Minmetals Securities Co. Ltd. subscribed for 40 million yuan, and Huatai United Securities Co. Ltd. participated with 80 million yuan. The company confirmed that its directors, senior management, shareholders with over 5% stake, and other related parties did not subscribe to this tranche.