Tianshan Materials gets CSRC approval for technology innovation bonds

Tianshan Materials Corporation Limited announced today that it has received approval from the China Securities Regulatory Commission (CSRC) for the registration of its public issuance of technology innovation corporate bonds to professional investors. The approval allows Tianshan Materials to issue bonds with a total face value not exceeding 100 bn yuan.

The company's board of directors initially approved the bond issuance plan on March 25, 2025, which was subsequently passed by the 2024 annual general meeting of shareholders. The CSRC's registration approval is valid for 24 months from the approval date, enabling the company to issue the bonds in tranches within this period.

Tianshan Materials will proceed with the bond issuance based on market conditions and its capital requirements, adhering strictly to the submitted prospectus filed with the Shenzhen Stock Exchange and all relevant legal and regulatory requirements. The company has also committed to timely disclosure of any significant developments between the registration approval date and the completion of the bond issuance.