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First Capital Securities to issue CNY 1 bn in technology innovation bonds

October 20, 2025 at 05:14 PM UTCBy FilingReader AI

First Capital Securities Co., Ltd. announced the public issuance of its second tranche of 2025 technology innovation corporate bonds to professional investors, with a maximum value of CNY 1 billion. This issuance is part of a larger registration for corporate bonds totaling up to CNY 8 billion. The bonds will have a 3-year fixed interest rate and will be issued at par, with no collateral. The company's credit rating is AAA, and the bond's credit rating is AAA, with a stable outlook.

The bond issuance process includes an offline interest inquiry from 15:00 to 18:00 on October 21, 2025 (T-1 day), with the final coupon rate to be announced on the same day. The subscription period will run from October 22, 2025 (T day) for one trading day. Funds raised will primarily support technology innovation businesses (at least 70%) and supplement working capital (up to 30%). The company's net assets as of June 30, 2025, were CNY 17.55 billion.

This report was generated by FilingReader's AI system from regulatory filings and company disclosures. To request a correction, contact editorial@filingreader.com

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