Fullhan Microelectronics reports Q3 convertible bond activity, plans EGM

Shanghai Fullhan Microelectronics (SZSE:300613) announced that in the third quarter of 2025, 260 "Fullhan Convertible Bonds" (SZSE:123122), totaling 26,000 yuan, were converted into 275 shares of "Fullhan Microelectronics" stock. As of September 30, 2025, the company has 5,802,533 outstanding "Fullhan Convertible Bonds" with a total face value of 580,253,300 yuan. The conversion period for these bonds runs from February 14, 2022, to August 5, 2027, with the latest conversion price at 91.69 yuan per share.

The company also announced an Extraordinary General Meeting (EGM) to be held on October 16, 2025, to discuss various proposals. Key items on the agenda include the issuance of H-shares and their listing on the Hong Kong Stock Exchange, as well as several internal governance amendments.

The EGM will address proposals such as the company’s conversion to a foreign-funded joint-stock company and a plan for the use of proceeds from the H-share offering. Shareholders can participate through on-site voting or online platforms provided by the Shenzhen Stock Exchange. The registration date for attending the meeting is October 9, 2025.