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Suzhou Bank raises 20 bn yuan to boost tech innovation

September 15, 2025 at 05:17 PM UTCBy FilingReader AI

Suzhou Bank Co., Ltd. recently completed the issuance of its first tranche of 2025 technology innovation bonds in the national interbank bond market, with approval from the People's Bank of China. The bond issuance was successfully booked on September 10, 2025, and payment was completed on September 12, 2025.

The issuance raised a total of 20 billion yuan through 5-year fixed-rate bonds, carrying a coupon rate of 1.89%.

The proceeds from these bonds are earmarked to support the technology innovation sector, in line with applicable laws and regulatory approvals. This includes providing technology loans and investing in bonds issued by technology innovation enterprises. The announcement was made by the board of directors of Suzhou Bank Co., Ltd. on September 15, 2025.

This report was generated by FilingReader's AI system from regulatory filings and company disclosures. To request a correction, contact editorial@filingreader.com

SZSE:002966Shenzhen Stock Exchange

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