Huatian Technology establishes new semiconductor packaging subsidiary in Nanjing
Tianshui Huatian Technology Co. Ltd. announced the successful registration and acquisition of a business license for its new wholly-owned subsidiary, Nanjing Huatian Advanced Packaging Co. Ltd. The establishment of this new entity was approved during the fourth meeting of the eighth board of directors.
Nanjing Huatian Advanced Packaging Co. Ltd. is jointly funded by Huatian Technology (Jiangsu) Co. Ltd., Huatian Technology (Kunshan) Electronics Co. Ltd., and Huatian Advanced No. 1 (Nanjing) Equity Investment Partnership (Limited Partnership). The new company, located at No. 18 Dingxiang Road, Pukou District, Nanjing City, Jiangsu Province, has a registered capital of RMB 200000万元. It was established on September 8, 2025.
The business scope of Nanjing Huatian Advanced Packaging Co. Ltd. includes integrated circuit manufacturing, integrated circuit chip and product manufacturing, electronic component manufacturing, technology services, development, consulting, exchange, transfer, and promotion, as well as sales of integrated circuits, electronic components, electronic specialized materials, and semiconductor specialized equipment, along with import and export of goods and technology.
This report was generated by FilingReader's AI system from regulatory filings and company disclosures. To request a correction, contact editorial@filingreader.com
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