Shenwan Hongyuan Securities completes bond redemption and delisting

Shenwan Hongyuan Group Co., Ltd. announced that its subsidiary, Shenwan Hongyuan Securities Co., Ltd., has completed the principal and interest payment for its 2023 publicly issued corporate bonds (third tranche) (series one), offered to professional investors.

The bonds, with a total issuance size of RMB 500 million, carried a coupon rate of 2.56% and a two-year term. Issued on August 30, 2023, the bonds' principal and interest payment date and delisting date were September 1, 2025.

Shenwan Hongyuan Securities Co., Ltd. fulfilled all obligations as per the offering memorandum, completing the bond redemption and delisting process. The announcement was made by the board of directors of Shenwan Hongyuan Group Co., Ltd. on September 2, 2025.