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Huagong Tech raises 500m yuan via innovation bonds

August 22, 2025 at 08:05 PM UTCBy FilingReader AI

Huagong Tech issued 500 million yuan in short-term commercial papers at 1.65% interest, with the 210-day bonds maturing in March 2026.

This report was generated by FilingReader's AI system from regulatory filings and company disclosures. To request a correction, contact editorial@filingreader.com

SZSE:000988Shenzhen Stock Exchange

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