Ingenic Semiconductor shifts focus to 3D DRAM development

Ingenic Semiconductor has signed a supervisory agreement for its raised funds, establishing oversight for its strategic pivot to 3D DRAM chip development.

The company has set up a dedicated account holding 237.6 million yuan for the "3D DRAM Chip R&D and Industrialization Project" at China Bank Hefei Branch.

This follows Ingenic Semiconductor's decision to reallocate funds from its previous "In-vehicle ISP Series Chip R&D and Industrialization Project" to focus on 3D DRAM technology instead. The funds are being channeled through subsidiary Beijing Silicon Motion Technology to Sci-tech Innovation (Shanghai).