Ingenic shifts focus from automotive chips to 3D memory

Ingenic Semiconductor has completed a strategic shift away from automotive chip development to focus on 3D DRAM technology.

The company transferred its "Automotive ISP Series Chip R&D and Industrialization Project" from subsidiary Hefei Ingenic Technology to another unit, Ingenic Semiconductor (Shanghai), which will now handle the "3D DRAM Chip R&D and Industrialization Project."

Hefei Ingenic Technology reduced its registered capital using remaining funds from the original automotive project, with its capital now standing at 247 million yuan.