FilingReader Intelligence
Hongxin Electron-Tech plans technology innovation bond issuance
July 6, 2025 at 09:39 AM UTC•By FilingReader AI
Xiamen Hongxin Electron-Tech Group (SZSE:300657) is seeking shareholder approval to issue technology innovation bonds, according to a recent announcement. The decision was made at the 42nd meeting of the company's fourth board of directors. The proposed issuance aims to optimize the company’s debt structure, reduce financial risks, and expand its production and operation scale.
This report was generated by FilingReader's AI system from regulatory filings and company disclosures. To request a correction, contact editorial@filingreader.com
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SZSE:300657•Shenzhen Stock Exchange
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