Maxscend outlines $347.5m share issue, capacity expansion

Maxscend Microelectronics has announced a revised plan for a private placement of A shares, seeking to raise up to CNY347.5 million to expand its radio frequency (RF) chip manufacturing capacity and supplement its working capital. The company plans to issue no more than 160,457,680 shares to no more than 35 specific investors. This initiative aims to enhance supply chain security, improve its technology capabilities, protect intellectual property, and strengthen its competitive position amid growing demand for high-end customized RF front-end products, with 8.42% growth in the integrated circuit industry.