Ingenic Semiconductor announces 2024 dividend distribution

Beijing Ingenic Semiconductor Co., Ltd. (SZSE:300223) announced the implementation of its 2024 annual dividend distribution plan, approved at the shareholders' meeting on May 12, 2025. Shareholders of record as of June 23, 2025, will receive a cash dividend of CNY 0.997988 per 10 shares. The total dividend payout amounts to CNY 48,156,985.09, based on the current total share capital of 482,540,723 shares. The ex-dividend date is set for June 24, 2025. Dividends for A-share holders will be directly transferred to their securities accounts through their custodian securities firms on June 24, 2025, while certain individual shareholders will be paid directly by the company. The company confirmed that the distribution plan remains consistent with the principles approved at the shareholders' meeting, even after adjusting for an increase in share capital due to the issuance of new shares related to restricted stock grants.