TongFu Microelectronics announces 2024 annual dividend distribution

TongFu Microelectronics (SZSE:002156) announced its 2024 annual equity distribution plan, approved at the May 13, 2025, shareholders meeting. Shareholders will receive a cash dividend of CNY 0.45 (including tax) per 10 shares. The total dividend payout amounts to CNY 68,291,861.04 (including tax) based on the total share capital of 1,517,596,912 shares as of December 31, 2024. The equity registration date is set for June 16, 2025, and the ex-dividend date is June 17, 2025. Hong Kong market investors holding shares through Shenzhen-Hong Kong Stock Connect, QFII, RQFII, and individuals and funds holding pre-IPO restricted shares will receive CNY 0.405 per 10 shares after tax. TongFu Microelectronics will directly transfer cash dividends to A-share shareholders through their custodian securities companies.