FilingReader Intelligence
Goke Micro plans major asset restructuring and equity raise
June 9, 2025 at 10:10 PM UTC•By FilingReader AI
Hunan Goke Microelectronics (SZSE:300672) is set to significantly expand its operations through a strategic asset restructuring and equity financing initiative. The company plans to acquire 94.366% of the equity in core component manufacturer, Zhongxin Integration Circuit (Ningbo), through a combination of share issuance and cash payments to 11 transaction counterparties.
This report was generated by FilingReader's AI system from regulatory filings and company disclosures. To request a correction, contact editorial@filingreader.com
Primary Source Document
Supplementary Source Documents
Announcement on the shareholding status of the top ten shareholders on the trading day before the suspension of trading due to planning major asset restructuringJune 5, 2025 at 08:00 AM UTC
Announcement of Resolutions of the Seventh Meeting of the Fourth Board of DirectorsJune 5, 2025 at 08:00 AM UTC
Explanation on the company's issuance of shares and payment of cash to purchase assets and raise supporting funds, as well as the purchase and sale of assets within 12 months before the related-party transactionJune 5, 2025 at 08:00 AM UTC
SZSE:300672•Shenzhen Stock Exchange
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