StarPower plans convertible bonds for power module expansion

StarPower Semiconductor announced its response to the Shanghai Stock Exchange's audit inquiry regarding its application for issuing convertible corporate bonds. The company plans to raise up to CNY 1.5 billion to fund three key projects: a Vehicle-grade SiC MOSFET Module Manufacturing Project, an IPM Module Manufacturing Project, and a Vehicle-grade GaN Module Industrialization Project, along with supplementary working capital. These projects aim to expand production of power semiconductor modules for emerging sectors like new energy vehicles and white goods.

The company's board of directors and shareholders approved the convertible bond issuance on December 24, 2025. This funding is crucial for addressing increasing market demand and ensuring technological leadership in the third-generation power semiconductor industry. All projects are progressing as planned, with environmental impact assessment approvals expected by December 2025.

StarPower’s recent financial performance shows a strong order book, with robust growth in IGBT, SiC MOSFET, and IPM modules. The new projects are expected to enhance the company's production capacity significantly, reinforcing its market position and ensuring continued profitability.