Gigadevice Semiconductor releases post-hearing pack for H-share offering

Gigadevice Semiconductor (Beijing) Inc. announced the publication of its post-hearing information pack for its proposed H-share offering and listing on the Main Board of the Hong Kong Stock Exchange. This follows the company's application submission to the Hong Kong Stock Exchange on June 19, 2025, and subsequent notification of H-share offering approval by the China Securities Regulatory Commission on December 9, 2025. The company's application for listing was reviewed by the Hong Kong Stock Exchange Listing Committee on December 15, 2025.

The post-hearing information pack, a draft document subject to updates, is published on the Hong Kong Stock Exchange website to provide information to the public and qualified investors. The company emphasized that this announcement and the information pack do not constitute an offer or solicitation for the acquisition, purchase, or subscription of any of its securities.

Gigadevice Semiconductor (Beijing) Inc. also highlighted that the H-share offering and listing remain subject to final approval from relevant regulatory bodies, including the Hong Kong Securities and Futures Commission and the Hong Kong Stock Exchange. Investors are advised to exercise caution due to the inherent uncertainties of the process.