Tongwei issues fourth tranche of green tech innovation bonds

Tongwei Co. announced the successful issuance of its 2025 fourth tranche of green technology innovation bonds. The bonds were issued on December 10, 2025, with an actual issuance amount of RMB 50,000.00. The bonds carry an interest rate of 2.07% and were issued at a face value of 100.00 per hundred yuan. The maturity period is 1+1 year, with the redemption date set for December 10, 2027.

The issuance was part of a larger registration for debt financing tools approved by the China Interbank Market Dealers Association (NAFMII) on April 28, 2025, allowing Tongwei to issue various debt instruments over a two-year period. The proceeds from this issuance were fully received on December 10, 2025.

China Merchants Bank served as the lead underwriter for the issuance, with CITIC Bank Corporation Limited and Chengdu Rural Commercial Bank Co., Ltd. acting as co-lead underwriters.