Tongwei finalizes third tranche green tech innovation bond issuance

Tongwei Co., Ltd. announced the successful issuance of its 2025 third tranche green technology innovation bonds. The bond, identified as "25 Tongwei GN003 (Science and Technology Innovation Bond)," has a term of 1+1 years. The total actual issuance amounted to CNY 50,000.00, matching the planned issuance volume.

The bonds carry an issue price of 100.00 per hundred yuan face value and an interest rate of 2.02%. The start date for interest calculation is November 19, 2025, with the redemption date set for November 19, 2027. All proceeds from this issuance were fully received on November 19, 2025.

Industrial Bank Co., Ltd. acted as the lead underwriter, with Bank of China Co., Ltd. and CITIC Bank Co., Ltd. serving as co-lead underwriters.