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Shenzhen Gas issues third tranche of science and technology innovation bonds

October 21, 2025 at 11:29 AM UTCBy FilingReader AI

Shenzhen Gas Group Co., Ltd. has successfully completed the issuance of its 2025 third tranche of science and technology innovation bonds. The issuance, registered on February 25, 2025, for a total of RMB15 bn in ultra-short-term financing bonds, saw the third tranche issued on October 20, 2025. The bonds carry a nominal value of RMB100.00 each, with a coupon rate of 1.64% and a term of 269 days. Interest will be repaid upon maturity, with the start date for interest calculation being October 21, 2025.

The planned and actual issuance amount for this tranche both stood at RMB15 bn. Beijing Bank Co., Ltd. served as the lead underwriter, with Hangzhou Bank Co., Ltd. acting as the joint lead underwriter.

Relevant issuance documents are available on China Money Network (www.chinamoney.com.cn) and Shanghai Clearing House (www.shclearing.com). The company's board of directors ensures the announcement's content is truthful, accurate, and complete.

This report was generated by FilingReader's AI system from regulatory filings and company disclosures. To request a correction, contact editorial@filingreader.com

SSE:601139Shanghai Stock Exchange

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