Gigadevice subsidiaries establish accounts for automotive electronics project funds
Gigadevice Semiconductor (Beijing) Inc. announced that its wholly-owned subsidiaries, including Xi'an Giga Device Integration Co. Ltd., Shanghai Giga Device Electronics Co. Ltd., Hefei Giga Device Integration Co. Ltd., and Shenzhen Giga Device Innovation Co. Ltd., have opened dedicated bank accounts for raised funds. This move follows the August 2025 approval to expand the "Automotive Electronics Chip R&D and Industrialization Project" with these entities as implementation bodies, increasing their capital by a total of 200 million yuan.
These subsidiaries, along with Gigadevice Semiconductor, China International Capital Corporation Limited, and China Merchants Bank, have signed a four-party supervision agreement. As of September 17, 2025, the dedicated accounts for each subsidiary, including account numbers 129908801210000, 121942339710000, 551906654910000, and 110941316010000, had a balance of 0 yuan. These accounts are specifically for the storage and use of raised funds for the automotive electronics project.
The total raised capital from a non-public offering in 2020 was 4,324.0235 million yuan, with a net amount of 4,284.4386 million yuan after deducting underwriting fees. As of June 30, 2025, the company had utilized 1,950.3019 million yuan, with a remaining balance of 1,057.5306 million yuan, reflecting interest income during the storage period.
This report was generated by FilingReader's AI system from regulatory filings and company disclosures. To request a correction, contact editorial@filingreader.com
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