Tongwei completes green technology bond issuance, raises 500m yuan

Tongwei Co., Ltd. announced the successful completion of its 2025 second-phase green technology innovation bonds issuance. The bonds, designated as "25 Tongwei GN002 (Tech Innovation Bond)," raised 500,000,000 yuan. The issuance was priced at 100.00 with an annual interest rate of 2.10%.

The bonds commenced interest accrual on September 17, 2025, and are set to mature on June 14, 2026, representing a 270-day term. China CITIC Bank Co., Ltd. served as the lead underwriter, with Industrial Bank Co., Ltd. and Shanghai Pudong Development Bank Co., Ltd. acting as joint lead underwriters.

This issuance falls under the company's broader debt financing tool registration, approved by the China Interbank Market Dealers Association on April 28, 2025. This registration allows Tongwei to issue various debt instruments, including green bonds, over a two-year period to meet its financing needs.