Citic Securities completes first tranche of tech innovation bond issuance

Citic Securities Company Limited announced the successful issuance of its 2025 technology innovation bond (first tranche) on September 10, 2025. This tranche, with bond code 342580003, had a total issuance amount of CNY 2.7 billion. The bonds mature on September 10, 2030, carry a fixed annual interest rate of 1.85%, and were issued at 100 yuan per 100 yuan face value.

This issuance follows the China Securities Regulatory Commission's (CSRC) approval for Citic Securities to issue corporate bonds totaling up to CNY 60.0 billion to professional investors. The approval is valid for 24 months, allowing for phased issuance.

The company's board and management will proceed with the bond issuance in accordance with regulatory requirements and the mandate from the 2023 annual general meeting. Related documents for the issued bonds are available on Chinamoney and Shanghai Clearing House websites.