AMEC launches six new semiconductor equipment products

Advanced Micro-Fabrication Equipment (China) (AMEC) has launched six new semiconductor equipment products, including etching, atomic layer deposition, and epitaxy systems. These new offerings are expected to broaden the company's product portfolio and provide new impetus for its growth in the semiconductor equipment market.

The new product lineup features two etching systems: the Primo UD-RIE® for ultra-high aspect ratio etching and the Primo Menova™ 12-inch ICP single-chamber etching equipment for metal etching. The Primo UD-RIE® boasts six single-reactor chambers and dynamic edge impedance control, enhancing wafer edge yield and stability. The Primo Menova™ is designed for metal Al line and Al block etching, offering high efficiency and precision.

Additionally, AMEC introduced four new thin-film deposition products, comprising three atomic layer deposition systems under the Preforma Uniflash® metal gate series (TiN, TiAl, and TaN) and one epitaxy system, PRIMIO Epita® RP. The Preforma Uniflash® series utilizes a dual-reactor design, supporting up to five reaction chambers, while the PRIMIO Epita® RP is a dual-chamber, low-pressure epitaxy system, noted for its compact size and ability to configure up to six reaction chambers, aiming to reduce production costs and chemical consumption.