FilingReader Intelligence
Tongwei raises 50m yuan via green bonds at 2.2%
July 29, 2025 at 11:39 AM UTC•By FilingReader AI
Tongwei Co completed its first tranche of 2025 green technology innovation corporate bonds, raising 50 million yuan at an annual coupon rate of 2.20%.
The bonds mature on April 27, 2026, with funds fully raised by July 29, 2025. China Everbright Bank served as lead underwriter, with Bank of Communications and Bohai Bank as joint lead underwriters.
This report was generated by FilingReader's AI system from regulatory filings and company disclosures. To request a correction, contact editorial@filingreader.com
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