FilingReader Intelligence
Tongkun Group raises 500m yuan via technology innovation bonds
July 16, 2025 at 09:30 AM UTC•By FilingReader AI
Tongkun Group Co., Ltd. raised 500 million yuan through its sixth tranche of technology innovation bonds issued on July 15.
The 268-day bonds carry a 1.75% interest rate and mature on April 10, 2026. Hangzhou Bank served as lead underwriter, with Industrial and Commercial Bank of China as co-lead underwriter.
This report was generated by FilingReader's AI system from regulatory filings and company disclosures. To request a correction, contact editorial@filingreader.com
SSE:601233•Shanghai Stock Exchange
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