Hengli Petrochemical completes bond issuance, employee stock plan ends

Hengli Petrochemical (SSE:600346) announced the successful issuance of its first phase of science and technology innovation bonds for 2025. The issuance, completed on June 25, 2025, in the interbank market, saw the company issue CNY1 billion in bonds, with a coupon rate of 1.85% and a maturity date of June 26, 2026. The bonds are officially titled "25恒力石化CP001(科创债)". China Industrial Bank acted as the lead underwriter, with China Merchants Bank and Postal Savings Bank of China serving as joint lead underwriters.