China CITIC Bank completes CNY 10bn bond issuance
China CITIC Bank Corporation Limited has announced the successful completion of its 2025 science and technology innovation bond issuance (Bond Connect). The bond, approved by the People's Bank of China, has a total issuance size of CNY 10 billion and a 3-year fixed interest rate of 1.66%. The bonds were priced on May 16, 2025, and were fully issued on May 20, 2025, on the interbank bond market. Proceeds from the issuance will be used to fund technology innovation loans and support the development of science and technology innovation businesses, subject to regulatory approvals. The bank's total outstanding financial bonds will not exceed CNY 4,000 billion.
This report was generated by FilingReader's AI system from regulatory filings and company disclosures. To request a correction, contact editorial@filingreader.com
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