Tongwei to seek DFI registration, boost financing flexibility

Tongwei Co., Ltd. announced its intention to seek registration for and issue Debt Financing Instruments (DFI) in the interbank market, according to a filing for its first extraordinary general meeting of shareholders in 2025. The plan aims to improve the company's financing structure, lower financing expenses, and increase efficiency in bond issuance. Shareholders will vote on the proposal to authorize the board or its designees to manage matters related to the registration and issuance, including determining the timing, type, and amount of each issuance. The funds raised will be used in accordance with regulatory requirements, which may include project construction, repaying bank loans, and supplementing working capital.