Tongwei completes issuance of RMB 5bn tech innovation notes

Tongwei Co., Ltd. (SSE: 600438) announced the successful completion of the issuance of its first tranche of ultra-short-term financing bonds (technology innovation notes) for 2025. The bonds, officially named "25 Tongwei SCP001 (Technology Innovation Notes)" with code 012580607, have a term of 270 days and will mature on December 5, 2025. The total issuance amounted to RMB 5 billion (50,000 million yuan) at a par value of 100 yuan per bond, with an interest rate of 2.60%. The value date was March 10, 2025. Joint lead underwriters for the issuance were Industrial Bank Co., Ltd. and China CITIC Bank Co., Ltd. The funds raised have been fully received by March 10, 2025. Details regarding the bond issuance are available on the websites of ChinaMoney.com.cn and Shanghai Clearing House (www.shclearing.com).