Kaynes Semicon partners with Japanese firms to boost India's chip ecosystem

Kaynes Semicon, a subsidiary of Kaynes Technology India Limited, has entered into technology collaborations to strengthen its semiconductor manufacturing operations in India. AOI Electronics will provide expertise in advanced packaging, panel-level packaging, and wafer-level redistribution layer (RDL) technologies. This positions Kaynes Semicon to offer world-class turnkey back-end semiconductor solutions for various sectors, including automotive, industrial, and consumer electronics.

The partnership with Mitsui & Co. is designed to secure critical raw materials for wafer fabrication and packaging, such as lead frames, molding compounds, die attach materials, specialty gases, and semiconductor-grade chemicals. This alliance aims to ensure supply chain resilience and support the development of a self-reliant semiconductor ecosystem in India, mitigating potential global disruptions.

These strategic collaborations align with the Indian government's "Make in India" and "Atmanirbhar Bharat" initiatives, accelerating the buildout of advanced manufacturing infrastructure. The partnerships are expected to enhance India's participation in the global semiconductor value chain and strengthen domestic capabilities for design, packaging, and material readiness to meet both local and international demand.