FilingReader Intelligence
Izmomicro achieves silicon photonics packaging breakthrough
August 21, 2025 at 06:09 AM UTC•By FilingReader AI
Izmomicro announced a breakthrough in silicon photonics packaging with a high-density platform supporting 32-channel fiber I/O and insertion loss under 2 dB. The module integrates 32 DC I/Os, 4 RF I/Os, and high-speed RF performance up to 70 GHz.
This report was generated by FilingReader's AI system from regulatory filings and company disclosures. To request a correction, contact editorial@filingreader.com
BSE:IZMO•Bombay Stock Exchange
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