Hengan International issues first tranche of corporate bonds
Hengan International Group Company Limited announced the successful issuance of the first tranche of its corporate bonds on December 4, 2025. This initial tranche, totaling RMB1.0 bn, carries a fixed coupon rate of 1.8% per annum with a one-year term. The company had previously secured approval from the China Securities Regulatory Commission to issue corporate bonds up to an aggregate amount of RMB10.0 bn to professional investors.
Following this first tranche, RMB9.0 bn of the approved corporate bonds remain unissued. The proceeds are earmarked for supplementing the company's working capital and that of its subsidiaries, as well as for the repayment of bank loans held by some domestic subsidiaries.
The board of directors includes Mr. Sze Man Bok, Mr. Hui Ching Lau, Mr. Xu Da Zuo, Mr. Sze Wong Kim, Mr. Hui Ching Chi, Mr. Li Wai Leung, and Mr. Xu Wenmo as executive directors. Independent non-executive directors include Mr. Theil Paul Marin, Ms. Ada Ying Kay Wong, Mr. Ho Kwai Ching, Mark, and Mr. Chen Chuang.
This report was generated by FilingReader's AI system from regulatory filings and company disclosures. To request a correction, contact editorial@filingreader.com
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